Hubspan Names Dr. Lewis Edelheit, Former General Electric Senior VP, to Board of Directors
Seattle, WA, September 16, 2005 - Hubspan, a leading integration solutions provider, today announced that Dr. Lewis S. Edelheit has joined its board of directors. Dr. Edelheit brings over 30 years of technological innovation and leadership experience with companies including General Electric Company (GE) and Quantum Medical Systems.
Dr. Edelheit retired from GE in December 2001, after a highly successful tenure as GE's Senior Vice President of Research and Development. His tenure included high technology product introductions throughout all of GE's businesses, including significant advances in Internet applications, design for Six Sigma quality, e-business initiatives, and the development of Corporate R&D global technology centers.
"Over the course of my career I have been very fortunate and have gained extensive experience in launching quality and multi-generational product initiatives, increasing global reach and leading successful technology innovations," said Dr. Edelheit. "I look forward to leveraging my experience and knowledge to further advance the success of Hubspan."
Other career highlights include numerous successful product introductions, such as digital X-ray and advanced ultrasound medical imagers, high-efficiency turbines for power generation, advanced lighting and electronics-based appliances, and weatherable plastics.
"We are honored to have Dr. Edelheit on our board of directors," said Alan Higginson, Hubspan CEO. "His depth of experience in building billion-dollar, quality-focused companies, launching revolutionary technology innovations, and incredible global e-business knowledge will provide invaluable insight, contributing significantly to the continued success and future growth of Hubspan."
In addition to Hubspan, Dr. Edelheit is on advisory Boards of the Ford Motor Company Design Institute, NIST's Advanced Technology Program, the Physics Department of the University of Washington and Harvard Medical and Beth Israel Deaconess Research and Education Institute in Boston. He is also on the Board of Directors of two public Corporations, Silicon Graphics, and Sonic Innovation.
Finally, he is a member of the National Academy of Engineering, the Industrial Research Institute (named as the 2003 Medalist), and a Fellow of the American Physical Society, who selected him as the recipient of the 2001 George E. Pake prize. He was a member of the Board of Trustees of Rensselaer Polytechnic Institute in Troy, NY from 1995 until 2002.
As a leading integration solutions provider, Hubspan delivers on the promise of the Business Internet. Hubspan's service-based integration solutions enable companies around the world to exchange mission-critical information with their partners, providing maximum security and world-class reliability. Robust standards-based technology combined with rapid implementation and superior service deliver strategic value to trusted customer relationships. Headquartered in Seattle, Washington, Hubspan is trusted to deliver by industry leading customers including The Boeing Company, Graybar, and Tradeplace. Additional information can be found at www.hubspan.com
Liaison Technologies is a global integration and data management company. It provides innovative solutions to integrate, transform, harmonize, manage and secure critical business data on-premise or in the cloud. With a comprehensive array of business-to-business and application-to-application integration and data transformation services, as well as on-premise and cloud-based data security solutions, Liaison's practitioners implement data management infrastructures adapted to each client's specific business requirements. Headquartered in Atlanta, Liaison has offices in the Netherlands, Finland, Sweden and the United Kingdom. For more information, visit www.liaison.com.
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